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Frore Systems has launched a new series of liquid-cooling coldplates designed for next-generation AI accelerators like Nvidia’s Rubin. The company states these bespoke units use diamond surfaces combined with a multi-stage 3D microstructure to target precise hotspots on chips such as the AMD Instinct MI400 and MI500-series. Frore claims this technology can manage power densities reaching 770 W/cm², reduce GPU temperatures by up to 22C compared to conventional coldplates, and improve AI token throughput per watt by as much as 35%.

The core innovation involves a diamond heat spreader integrated directly above the GPU’s hotspots. Frore explains that diamond has exceptionally high thermal conductivity, exceeding 20 W/cm·K, which is significantly higher than copper’s approximately 4 W/cm·K. While the company notes its original LiquidJet coldplate reduced temperatures by about 12C and improved efficiency by 25%, the new LiquidJet Diamond solution promises a total reduction of 16C to 22C and an efficiency gain of 30% to 35%. Frore also expects over 150% higher maximum hotspot power density based on its models.

Frore plans to demonstrate this technology at the OCP Global Summit from October 12 to 16. The presentation will feature cooling for Nvidia’s 2,300W Rubin accelerator and hotspots reaching 770 W/cm². However, the company has not yet disclosed whether the demonstration uses production GPUs or thermal test vehicles. Frore also did not reveal how the diamond wafers are manufactured or integrated into the final coldplate assembly.