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Shenzhen Tuozhu Technology, the parent company of Bambu Lab, has filed a U.S. patent application for a new heatbed design published on September 10, 2026. The goal is to heat the print surface more evenly to reduce peeling issues reported by users of various 3D printer brands. The patent abstract states that the heating unit sits between the bed body and the bottom case, connected to a power supply at both ends to heat the bed body directly. This setup aims to improve adhesion and overall print quality without describing independent zone control.

Visuals in the application show a design replacing the current laminated heating sheet with a "heated bed body." The patent claims describe a machined channel running through the aluminum, shaped like the Chinese character for "sunken" or depressed. A single long heating element loops around inside this recess and connects to power at each corner. This configuration may help large prints that use most of the bed surface reach target temperatures faster, though it does not allow for independent zone heating.

Creating a single machined piece of aluminum is costly, so the design might instead use multiple layers or smaller pieces. While the application also includes generic CoreXY printer claims, infringement would only apply if a printer uses this specific patented heatbed. The patent remains pending and unenforceable until granted. If approved and proven superior, it could potentially lead to higher prices for replacement parts, but performance data is currently unavailable.