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GlobalFoundries and TSMC have signed a five-year manufacturing agreement valued at $2 billion. Under this deal, GlobalFoundries will produce silicon interposers for TSMC’s CoWoS advanced packaging technology in the United States. These interposers are custom pieces of silicon that connect logic chiplets to high-bandwidth memory stacks, enabling complex multi-die processors for artificial intelligence and high-performance computing. Volume production is scheduled to ramp up in the first half of 2028 at GlobalFoundries’ facility in Malta, New York.

Ed Kaste, senior vice president of CMOS Business at GlobalFoundries, stated that this arrangement creates a secure, scalable source of essential advanced-packaging elements to help customers accelerate innovation. While specific production capacity numbers remain undisclosed, the agreement includes a framework for additional expansion based on demand. The interposers must meet strict power-delivery and signal-integrity requirements, and some designs may require stitching because they exceed standard lithographic reticle sizes.

GlobalFoundries will act as a subcontractor rather than a direct TSMC supplier, manufacturing multiple customer-specific designs to ensure compatibility with TSMC’s packaging flows. This move allows TSMC to free up resources for other tasks while potentially establishing a largely domestic supply chain by 2029. The plan involves logic dies made in Arizona, interposers produced in New York, and assembly performed by TSMC or Amkor in Arizona, though final details on division of labor remain unclear.