Excerpt: The opening of an article from Tom’s Hardware. Read the original for the full story.
Qualcomm has reached a deal to license Huawei patents behind the LogicFolding chip-stacking method, Bloomberg reports. The technology, which is used in the Kirin 9050 Pro, splits nearly every block across two bonded dies, and a teardown and die shots show the lower die holds mostly cache and I/O.
Qualcomm’s multiyear, cross-license deal with Huawei has a wide scope, covering 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson told Bloomberg . Qualcomm also intends to purchase specific Huawei U.S. patents in compute, AI, networking, and other technologies, according to a release.
Source: Tom’s Hardware • Shane Downing • October 7, 2026