GlobalFoundries to produce silicon interposers for TSMC’s CoWoS in the US — Five-year agreement valued at $2 billion
AI-rewritten: This is a summary of an article from Tom’s Hardware, rewritten by AI (Qwen, running locally) to make it easier to read. The facts come from the original article – read it for the full story.
GlobalFoundries and TSMC have signed a five-year manufacturing agreement valued at $2 billion. Under this deal, GlobalFoundries will produce silicon interposers for TSMC’s CoWoS advanced packaging technology in the United States. These interposers are custom pieces of silicon that connect logic chiplets to high-bandwidth memory stacks, enabling complex multi-die processors for artificial intelligence and high-performance computing. Volume production is scheduled to ramp up in the first half of 2028 at GlobalFoundries’ facility in Malta, New York.